As the year of service of PPIA 2018-2019 committee is coming to an end, PPIA held the Indonesian Students International Conference or KIPI. It was conducted successfully on July 3 – 6, 2019 in Monash University Caulfield as the main venue. This program actually was not only about the conference itself but also the PPIA youth entrepreneurship gala dinner, Australia Alumni Networking Chamber (AANC), and the PPIA Congress. At the end of the program, there were internal bonding activities to strengthen the relation amidst committee as their work will end soon.
After officially opened by Kristiarto Legowo, the Ambassador of Indonesia in Australia, the main discussion of the day was conducted on the first day. It talked about the demographic bonus in Indonesia, the challenges and benefits. The main panelists were Dr. Iwu Dwisetiyani Utomo and Prof. Peter McDonalds. After having a break and lunch, the conference was continued to another discussion. It talked about the social and cultural aspects of Indonesia, and the panelists were Dr. Nasya Bahfen and Budiman Sudjatmiko.
On the second day, July 4, 2019, the discussion moved to technological matters which focused on economy creative and technological innovation and information. Rudi Purba, Iwan Sunito, Tatum Ona Kembara, and Helen Brown were the panelists. In the second session of the discussion, Blibli, a leading market place company, delegations appeared to give their presentation about eCommerce in Indonesia and what career opportunities offered by Blibli at the moment. On the same day, the Gala Dinner was held in the Republic of Indonesia General Consulate office. This session had a discussion about industry 4.0 age and gave opportunities for the guests to broaden their professional network during the dinner.
The Congress, where the committees reported their work, was held on the third day, July 5, 2019. On the same day, in dinner time, there was AANC in the Republic of Indonesia General Consulate office. And finally, the program was closed on the fifth day by having internal bonding.